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Samsung introduced GDDR6 memory chips, which, according to their statement, is “the industry’s first next-generation graphics DRAM technology”. It offers significant improvements over traditional GDDR6 memory products by introducing an additional DRAM device to basically double the capacity and bandwidth. Samsung has stated that the new GDDR6W will bring all these improvements and will have the same energy consumption as the regular GDDR6.
The new chips developed will also allow users to use the new technology without major changes to the existing hardware. The new Samsung GDDR6W features a new technology that the brand calls FOWLP or Fan Out Wafer Level Packaging. The new packaging process allows it to offer a more compact design with thinner lettering patterns. This allows packaging with a typical thickness reduced from 1.1mm to 0.7mm.
According to CheolMin Park, Vice President of New Business Planning, Samsung Electronics Memory Business Unit, “With GDDR6W, we are able to support differentiated memory products that can meet a variety of customer needs – this is a big step towards securing our market leadership.” The company hopes that the new GDDR6W memory will provide better performance for AI and high-performance computing accelerators. However, this will also be announced on small forfactor devices like laptops.
